In the entire semiconductor manufacturing process, the role of plastic is mainly to encapsulate and transport, connect various processing processes, prevent pollution and damage, optimize pollution control, and improve the yield of key semiconductor manufacturing processes. The plastic materials used include PEEK, PPS, PP, ABS, PVC, PBT, PC, fluoroplastics, PAI, COP, etc. With the continuous development of semiconductor technology, the performance requirements for materials are also increasing.

With the increasing demand for chips in various fields such as communication equipment, consumer electronics, and automobiles, the shortage of chips is becoming increasingly severe. The chip manufacturing process is very complex. In semiconductor manufacturing, silicon wafers, electronic specialty gases, masks, photoresists, target materials, chemicals, and other materials and related equipment often receive more attention. Few people introduce the guardian that runs through the entire semiconductor process - plastic.

The biggest challenge facing semiconductor manufacturing is pollution control, especially with the development of semiconductor technology, electronic components are becoming smaller and more complex, with lower tolerance for impurities and increasingly stringent production conditions. Dust removal, high temperature, highly corrosive chemicals, etc.

In the entire semiconductor manufacturing process, the role of plastic is mainly to encapsulate and transport, connect various processing processes, prevent pollution and damage, optimize pollution control, and improve the yield of key semiconductor manufacturing processes. The plastic materials used include PEEK, PPS, PP, ABS, PVC, PBT, PC, fluoroplastics, PAI, COP, etc. With the continuous development of semiconductor technology, the performance requirements for materials are also increasing.

The application of special engineering plastic PEEK/PPS in semiconductor manufacturing was emphasized

1. CMP fixing ring
Chemical mechanical polishing (CMP) is a key process technology in the chip production process. During the grinding process, CMP fixing rings are used to fix the silicon wafer and silicon wafer. The selected materials should have good wear resistance, dimensional stability, chemical corrosion resistance, easy processing, and avoid scratches and contamination on the surface of silicon wafers/circles.
CMP fixing ring is used to fix the chip during the grinding process. The selected material should avoid scratches and contamination on the surface of the chip. It is usually made of standard polyphenylene sulfide.
PEEK has high dimensional stability, ease of processing, good mechanical properties, excellent chemical corrosion resistance, and good wear resistance. Compared with PPS rings, CMP retaining rings made of PEEK have stronger wear resistance and double the service life, thereby reducing downtime and increasing chip production.
Materials: PEEK, polyphenylene sulfide

2. Wafer carrier
As the name suggests, wafer carriers are used to load wafers, including wafer carrier boxes, wafer transfer boxes, and wafer boats. The time that chips are stored in transport boxes accounts for a large part of the entire production process, and the material, quality, and cleanliness of the chip box itself may have varying degrees of impact on the quality of the chips.
Chip carriers are generally made of materials that are resistant to high temperatures, have excellent mechanical properties, dimensional stability, durability, anti-static, low gas release, low precipitation, and can be recycled. PEEK can be used to manufacture vehicles for general transmission processes. Generally, anti-static PEEK is used. PEEK has many excellent properties, such as wear resistance, chemical corrosion resistance, dimensional stability, anti-static properties, and low gas release, which help prevent particle contamination. And improve the reliability of chip processing, storage, and transfer.
Materials include PEEK, PFA, PP, PES, PC, PEI, COP, etc., which are generally modified with anti-static properties

3. Mask box
Photomask is a pattern master used in the photolithography process of chip manufacturing. It uses quartz glass as the substrate and is coated with chromium metal to block light. Using the principle of exposure, a light source is projected onto a silicon wafer through a photomask to expose and display specific patterns. Any dust or scratches attached to the photomask will reduce the quality of the projected image. Therefore, it is necessary to avoid contamination of the photomask and prevent particles generated by collision or friction from affecting the cleanliness of the photomask.
In order to avoid damage to the photomask caused by fogging, friction, or displacement, the photomask pod is generally made of anti-static, low exhaust, and durable materials.
PEEK has the characteristics of high hardness, minimal particle formation, high cleanliness, anti-static, chemical corrosion resistance, wear resistance, hydrolysis resistance, good dielectric strength, and good radiation resistance. And during the processing of the dividing board, the dividing board chip can be stored in an environment with low gas release and low ion pollution.
Materials: anti-static PEEK, anti-static PC, etc

4. Wafer Tools
Tools used for clamping wafers or silicon wafers, such as wafer clamps, vacuum suction pens, etc., ensure the integrity and cleanliness of the wafer surface by using materials that will not scratch the wafer surface and leave no residue.
PEEK has the characteristics of high temperature resistance, wear resistance, good dimensional stability, low gas release rate, and good moisture absorption. When using PEEK wafer clamps to clamp chips and silicon wafers, there will be no scratches on the surface of the chips or silicon wafers. Scratches will not leave residue on chips and silicon wafers due to friction, thereby improving the surface cleanliness of chips and silicon wafers.
Material: PEEK

5. Semiconductor packaging test socket
A test socket is a device that directly connects the electrical circuit of each semiconductor component to a testing instrument. Different test sockets are used to test various microchips specific to integrated circuit designers. The materials used for testing sockets should meet the requirements of good dimensional stability, high mechanical strength, minimal burr formation, good durability, wide temperature range, and easy processing.
Materials: PEEK, PPS, PAI, PI, PEI